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Howchip HC7420-UFSeMM
    · Name : Howchip HC7420-UFSeMM
    · Size (Pkg.) : 36.00cm x 24.00cm x 7.00cm (WxDxH)
    · Weight (Pkg.) : 19.00 kg
    · Offered Price : $ [Not included Tax&Duty]
    · Quantity : EA
    · Shipping Area :
*F-FEDEX, K-우체국


Howchip HC7420-UFSeMM

  • World First UFS 2.0 and eMMC 5.1, 2-in-1 Test Platform
  • Powered by Samsung Exynos 7420, 64-bit Arm Cortex57/53 Octa Core Processor
  • Run by the Latest Android OS Lollipop
HC7420 Full package

HC7420-UFSeMM is a full featured UFS 2.0 and eMMC 5.1 Test/Evaluation platform that provides an ideal test environment for UFS and eMMC performance and reliability test. Based on the latest Samsung Exynos7420, the 64-bit Octa Core Processor, it supports the most of Smart phone/Tablet PC fearturs(except for Modem). And additional features such as High speed Gigabit Ethernet, HDMI etc and UFS/eMMC socket are available so that users can develop UFS 2.0 and eMMC 5.1 test program in real environment condition.

In addition, this platform provides power consumption monitoring feature for UFS and eMMC device. This feature helps UFS and eMMC developers monitor power consumption through serial interface and easily get immediate power data during system operation in each mode.

Key Benefits

  • Two socket footprints are supported to test UFS and eMMC devices. (However one socket can be mounted at a time.)
  • Able to test UFS 2.0 and eMMC in real-environment of Android Lollipop
  • Able to test UFS 2.0 and eMMC in Linux kernel or ubuntu
  • Additional circuitary to monitor power consumption of UFS or eMMC devices during operation.

Brief Specification of Exynos 7420

  • ARM Cortex-A57-based Quad CPU with NEON/VFP as high performance processor with 48/32 KB I/D Cache, 2 MB L2 Cache.
  • ARM Cortex-A53 Quad CPU known as Apollo as power-efficient performance processor with 32/32 KB I/D Cache, 256 KB L2 Cache. This processor is architecturally aligned with Cortex-A57
  • 128-bit multi-layer network-on-chip (NoC) architecture
  • DRAM access through four channels of 16-bit LPDDR4 interface @ 1600 MHz (25.6 GB/sec), 3GB POP on CPU
  • 128 KB ROM for secure booting and 376 KB internal RAM for security function
  • Multi-core timer and generic interrupt controller/combiner for multi-core CPU system
  • DMA controllers (2x 4-channel PDMA, and 1x 4-channel PDMA for security purpose)
  • 3D graphic accelerator with multi-core GPU. This GPU supports OpenGL ES (1.1, 2.0, and 3.0), OpenCL (1.1 Full Profile), and OpenVG (1.1)
  • Separate 2D graphic accelerator
  • Multi-Format Codec (MFC) which provides encoding and decoding of MPEG-4/H.263/H.264/Divx/VP8/HEVC up to 1920 x 1080 @ 160 fps and decoding of MPEG-2/VC1/VP9 video up to 1920 x 1080 @ 160 fps
  • JPEG codec for various compression formats
  • 1/2/4/8 bpp palletized, or 16/18/24 bpp non-palletized color TFT support
  • UHD LCD display through MIPI DSI interface and 1/3 Mobile Image Compressor (MIC). This interface supports stereo 3D display.
  • HDMI version 1.4a interface for TV monitor
  • eDP interface with 5.4Gbps speed
  • Four channels of MIPI CSI interface for four camera support (one rear camera, one front camera, and two sensors like a vision sensor to measure the distance)
  • High performance ISP engine with DRC, 3DNR, VDIS, FD, and 3AA features. The ISP engine can accommodate these scenarios:
    • 20 MP @ 30 fps + 8 MP @ 30 fps
    • 20 MP 12 fps still capture
    • Maximum 20 MP still image
    • UHD 30 fps camcording and preview
  • Dedicated peripherals for camera module control (I2C, SPI, and UART)
  • Ultra low-power audio decoding co-processor with internal SRAM
  • I2S/PCM (2 channels) and Slim-bus (1 channel) for audio interface
  • Universal Flash Storage (UFS) for high-speed (1.2 GB/s) NAND interface
  • SD3.0/MMC5.5 interfaces (2 channels, 8-bit, 1.8 V only) and SD3.0 interfaces (1 channel, 4-bit, wide-range)
  • Super-speed (5 Gbps) USB3.0 DRD (1 channel) with USB2.0 backward compatibility
  • USI with high-speed I2C (12 channels)
  • SPI (6 channels) and 3 Mbps UART (4 channels) for Bluetooth 2.0
  • On-chip HSIC (1 channel), MIPI-LLI (1 channel), and PCIe (2-channel) for modem chip interface
  • Sturdy crypto engine with DTRNG, hardware hash function accelerator, provision keys, and monotonic counters
  • 12-bit general purpose ADC (8 channels), and on-die thermal sensors (13 units)

HC7420-UFSeMM Main board Specification

CPUExynos 7420 ARM Cortex A57 Quad, A53 Quad @1.8GHz
MemoryLPDDR4 3GB 1600MHz POP type
StorageeMMC5.1, SD card(SD 3.0) slot
TV/Monitor outHDMI v1.4a for Full HD resolution
DisplayMIPI DSI 4 lane x 2 ch for QHD resolution
NetworkGigabit Ethernet, WiFi/BT
CameraMIPI CSI 4 channel (Front camera, Rear camera, 2 Vision sensor)
PCIeReserved for future use(Gen2)
USB3.0USB 3.0 DRD, supporting super speed 5Gbps(USB3-micro-AB
USB2.0USB2.0 Host 2 ports
AudioTwo-in-one standard Audio jack for earphone and Line-in
General IOGPIO, I2C, SPI, UART and more…
Mechanical Size140mm x 150mm
SoftwareAndroid 5.0 Lollipop @ Linux kernel 3.10.9 / Ubuntu 15.04 without HDMI Interface
Sources will be provided on delivery

HC7420-UFSeMM Board Description

HC7420 board image

Ordering Information

The product, HC7420-UFSeMM consists of following items:

  • a Main board with an UFS socket mounted on top(One socket only)
  • an OLED Mobile Display with 5.9 inch, FullHD Resoluction
  • Power adaptor
  • Cables: Serial cable for Debug and Power monitoring

This product is not intended for general use, specifically designed for testing UFS and eMMC device in engineering lab.

Please contact to inquire for purchase and further information.

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대표이사 : 배수태, 통신판매업신고 : 2012-경기성남-0822호